(Click figure to enlarge)
In UHV, the two surfaces to be stamped together can be individually prepared.
The particular example chosen here shows that a self-assembled monolayer
SAM) can be attached to the hard surface of a semiconductor and an ultrathin
layer (~2nm) of metal (Ti) can be deposited on the soft Au pad. The initial
gaps at the interface due to surface roughness (lower left) can be fille- in
upon added pressure (lower right).