(Click figure to enlarge)
UHV Stamping
In UHV, the two surfaces to be stamped together can be individually prepared. The particular example chosen here shows that a self-assembled monolayer SAM) can be attached to the hard surface of a semiconductor and an ultrathin layer (~2nm) of metal (Ti) can be deposited on the soft Au pad. The initial gaps at the interface due to surface roughness (lower left) can be fille- in upon added pressure (lower right).